ic packages meaning in English

管瓷

The analysis of delamination and fracture in ic packages
湿热导致电子元件封装脱层断裂的分析
Coplanarity problems of ic packaging
集成电路封装的共面性问题
Design of motion control system with high speed and high precision positioning platform for ic package
面向芯片封装的高速精密定位平台控制系统设计
At present , bga / csp is becoming the mainstream of the advanced ic package technology
目前微电子球栅阵列尺寸封装( bga csp )正成为高端ic封装的主流技术。
Reinvest jingyang technology co . , ltd engaging in ic package , manufacture , test , and the components producing and selling
转投资晶扬科技股份有限公司，从事集成电路封装制造测试服务及其零组件加工销售

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